Place of Origin: | wuxi |
Brand Name: | HANSEJOHN |
Certification: | Rohs,ISO |
Model Number: | ceramic resonator7.37Mhz ZTTCP7.37MG/PBRC7.37MR30ZX00/CSTCC SERIES |
Minimum Order Quantity: | 10000PCS |
---|---|
Price: | $0.3 |
Packaging Details: | REEL |
Delivery Time: | 35 day |
Payment Terms: | paypal, Western Union, MoneyGram |
Supply Ability: | 10000000pcs PER YEAR |
Frecuencia: | 7.37Mhz | Frequency Accuracy (%): | ±0.5 Max |
---|---|---|---|
Estilo De Terminación: | SMD/SMT | Temperature Coefficient Of Oscillation Frequency (%) Max.: | ±0.3 (Oscillation Frequency Drift,-25℃~+85℃) |
Oscillation Frequency Aging Rate(10years) (%) Max: | ±0.2 (From Initial Value) | Withstanding Voltage (V): | 50 (DC,1min) |
Insulation Resistance Ri,(MΩ)min.: | 500 (10V,1min) | Temperature Stability (-20℃~ +80℃ ): | ±0.5% Max (-25℃ ~ +80℃) |
Rating Voltage UR(V): | 15V P-p | Operating Temperature: | -25℃ ~ +85℃ |
Storage Temperature: | -55℃ ~ +85℃ | Insulation Resistance(DC 25V 1 Minute): | 100MΩ Min |
Input/Output Impedance: | 330 Ω |
1.SCOPE
This specification shall cover the characteristics of the ceramic resonator with the type ZTTCP7.37MG50HC0-R1.
2.PART NO.
PART NUMBER | PREVIOUS PART NUMBER |
ZTTCP7.37MG50HC0-R1 | |
CUSTOMER PART NO | SPECIFICATION NO |
3.OUTLINE DIMENSIONS AND MARK
3.1 Appearance: No visible damage and dirt.
3.2 Construction: SMD ceramic packaging.
3.3 The products conform to the RoHS directive and national environment protection law.
3.4 Dimensions and mark
4.ELECTRICAL SPECIFICATIONS
4.1 RATING
Items | Requirement |
Withstanding Voltage (V) | 100 (DC,5s max) |
Insulation Resistance Ri,(MΩ)min. | 500 (10V,1min) |
Operating temperature | -25℃~+85℃ |
Storage temperature | -55℃~+85℃ |
Rating Voltage UR(V) | 6V DC |
15V p-p AC |
4.2 ELECTRICAL SPECIFICATIONS
Items | Requirement |
Oscillation Frequency Fosc(MHz) | 7.37Mhz |
Frequency Accuracy (%) | ±0.5 |
Resonant Impedance Ro(Ω)max. | 30 |
Temperature Coefficient of OscillationFrequency (%) max. |
±0.3(Oscillation Frequency drift,-25℃~+85℃) |
Oscillation Frequency Aging Rate (%) max *1 |
±0.1(From initial value) |
* Components shall be left in a chamber of +85±2℃ for 1000 hours, then measured after leaving in natural condition for 1 hours.
5.TEST
5.1 Test Conditions
Parts shall be tested under the condition ( Temp.:20±15℃,Humidity :65±20%
R.H.) unless the standard condition(Temp.:25±3℃,Humidity :65±10% R.H.)
is regulated to measure.
5.2 Test Circuit
6 PHYSICAL AND ENVIRONMENTAL CHARACTERISTICS
No | Item | Condition of Test |
Performance Requirements |
|
6.1 | Humidity | Keep the resonator at 60℃±2℃ and 90%-95% RH for 96h. Then Release the resonator into the room Condition for 1h prior to the Measurement. | It shall fulfill the specifications in Table 1. | |
6.2 |
High Temperature Exposure |
Subject the resonator to 85℃±2℃ for 96h, then release the resonator into the room conditions for 1h prior to the measurement. | It shall fulfill the specifications in Table 1. | |
6.3 |
Low Temperature Exposure |
Subject the resonator to -40℃±2℃ for 96h, then release the resonator into the room conditions for 1h prior to the measurement. | It shall fulfill the specifications in Table 1. | |
6.4 |
Temperature Cycling |
After temperature cycling of blow table was performed 5 times, resonator shall be measured after being placed in natural conditions for 1h. | It shall fulfill the specifications in Table 1. | |
Temperature | Time | |||
–25±3℃ | 30±3 min | |||
85±3℃ | 30±3 min | |||
6.5 | Vibration | Subject the resonator to vibration for 2h each in x,y and z axis With the amplitude of 1.5mm, the frequency shall be varied uniformly between the limits of 10 Hz—55Hz. | It shall fulfill the specifications in Table 1. | |
6.6 |
Mechanical Shock |
Drop the resonator randomly onto a wooden floor from the height of 100cm 3 times. | It shall fulfill the specifications in Table 1. | |
6.7
|
Soldering Test |
Components shall be measured after applying twice of the re-flow soldering with following temperature profile and leaving in natural condition for 1 hour. |
It shall fulfill the specifications in Table 1. |
6 PHYSICAL AND ENVIRONMENAL CHARACTERISICS
No | Item | Condition of Test |
Performance Requirements |
6.8 |
Solder Ability |
Dipped in 245℃±5℃ solder bath for 3s±0.5 s with rosin flux (25wt% ethanol solution.) | The terminals shall be at least 95% covered by solder. |
6.9 | Board Bending |
Mount a glass-epoxy board (Width=40mm,thickness=1.6mm),then bend it to 1mm displacement and keep it for 5s. (See the following figure)
|
Mechanical damage such as breaks shall not occur. |
Table 1
Item | Specification after test |
Oscillation Frequency Change △Fosc/Fosc (%) max |
±0.2 |
Resonant Impedance Ro(Ω)max. | 35 |
The limits in the above table are referenced to the initial measurements. |
7 RECOMMENDED LAND PATTERN AND REFLOW SOLDERING STANDARD CONDITIONS
7.1Recommended land pattern
7.2Recommended reflow soldering standard conditions
8.PACKAGE
To protect the products in storage and transportation,it is necessary to pack them(outer and inner package).
8.1 On paper pack, the following requirements are requested.
8.1.1 Dimensions and Mark
NO. | Name | Quantity |
① | Package | 1 |
② | Inner Box | 10 |
③ | Belt | 2.9 m |
④ | Adhesive tape | 1.2 m |
⑤ | Label | 1 |
⑥ | Certificate of approval | 1 |
⑦ | Company name ,Address etc. |
8.1.2 Section of package
Package is made of corrugated paper with thickness of 0.8cm.Package has 10 inner boxes, each box has 1 reel(each reel for plastic bag)
8.1.3 Quantity of package
Per plastic reel 4000 pieces of piezoelectric ceramic part
Per inner box 1 reel
Per package 10 inner boxes
(40000 pieces of piezoelectric ceramic part )
8.1.4 Inner Box Dimensions
NO. | Name | Quantity |
① | Inner Box | 1 |
② | QC Label | 1 |
③ | Label | 1 |
8.2 On reel pack, the following requirements are requested.
8.2.1 Reel Dimensions
φA | φB | W | T | Pieces per reel | Carrier tape size |
330±3 | 80min | 16.4min | 22.4max | 4000typ. | 16 |
8.2.3 Packing Method Sketch Map
8.2.4Test Condition Of Peeling Strength
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9.EIAJ Monthly Code
2011/2013/2015/2017 | 2010/2012/2014/2016 | ||
MONTH | CODE | MONTH | CODE |
JAN | A | JAN | N |
FEB | B | FEB | P |
MAR | C | MAR | Q |
APR | D | APR | R |
MAY | E | MAY | S |
JUN | F | JUN | T |
JUL | G | JUL | U |
AUG | H | AUG | V |
SEP | J | SEP | W |
OCT | K | OCT | X |
NOV | L | NOV | Y |
DEC | M | DEC | Z |
10.OTHER
10.1 Caution
10.1.1 Don’t apply excess mechanical stress to the component and terminals at soldering. Do not use this product with bend.
10.1.2 Do not clean or wash the component for it is not hermetically sealed.
10.1.3 Do not use strong acidity flux,more than 0.2wt% chlorine content,in flow soldering.
10.1.4 Don’t be close to fire.
10.1.5 This specification mentions the quality of the component as a single unit. Please insure the component is thoroughly evaluated in your application circuit
10.1.6 Expire date (Shelf life) of the products is 12 months after delivery under the conditions of a sealed and an unopened package. Please use the products within 12 months after delivery. If you store the products for a long time (more than 12 months), use carefully because the products may be degraded in the solderability or rusty. Please confirm solderability and characteristics for the products regularly.
10.2 Notice
10.2.1 Please return one of this specification after your signature of acceptance.
10.2.2 When something gets doubtful with this specifications, we shall jointly work to get an agreement.